Processing Properties | Metric | English | Comments |
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Cure Time | 3.00 min @Temperature 150 °C |
0.0500 hour @Temperature 302 °F |
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Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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Cure Time | 3.00 min @Temperature 150 °C |
0.0500 hour @Temperature 302 °F |
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Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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Cure Time | 3.00 min @Temperature 260 °C |
0.0500 hour @Temperature 500 °F |
Wave Solder |
Parker Chomerics CHO-FLEX 601 Conductive Coating CHO-FLEX™ 601 coating is specifically designed for EMI shielding of copper/Kapton flexible circuit laminates and for printing circuits on Kapton film. Upon cure, this coating exhibits excellent adh.. |
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Cure Time | 3.00 min @Temperature 150 °C |
0.0500 hour @Temperature 302 °F |
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Parker Chomerics THERM-A-FORM T646 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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Cure Time | 3.00 min @Temperature 155 °C |
0.0500 hour @Temperature 311 °F |
ts2 |
TSE Industries Millathane® 76 Millable Polyester Polyurethane Rubber, 3.0 PHR MBT Millathane® 76 is a very suitable choice for use in products such as bushings, small copier rolls; automotive applications — bumpers, o-rings, hydraulic seals, belts, gaskets, solid tires — and m.. |
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Cure Time | 3.00 min @Temperature 150 °C |
0.0500 hour @Temperature 302 °F |
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Resin Technology Group TIGA 905 One-Part Silver Conductive Epoxy System Cure 6 minutes at 130°C or 3 minutes at 150°C.TIGA 905 is a stress-absorbing and electrically conductive, silver-filled epoxy adhesive recommended for solder replacement in microelectronic interco.. |
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Cure Time | 3.00 min @Temperature 120 °C |
0.0500 hour @Temperature 248 °F |
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Lord Adhesives CircuitSAFâ„¢ MA-420 Epoxy Surface Mount Adhesive CircuitSAFâ„¢ MA-420 is an epoxy surface mount adhesive that cures rapidly at elevated temperatures and has been designed for use in high speed printed circuit board assembly for the attachment o.. |
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Cure Time | >= 3.00 min @Temperature 135 °C |
>= 0.0500 hour @Temperature 275 °F |
on-line cycle |
Lord Adhesives Flocklok® 7000/7204 Flock Adhesive LORD Flocklok® 7000/7204 adhesive is a two-part, single-coat adhesive used for adhering polyester or nylon flock fibers to a variety of thermoplastics, including PVC, Alcryn®, Sunprene®, ny.. |
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Cure Time | 3.00 min @Temperature 204 °C |
0.0500 hour @Temperature 399 °F |
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Lord Adhesives Flocklok® 853 Blocked Flock Adhesive Flocklok® 853 is a blocked, heat-curing, single coat adhesive used to adhere polyester or nylon fibers (flock) to a variety of elastomers including EPDM, NR, CR, and SBR. Flocked substrates provi.. |
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Cure Time | 3.00 min @Temperature 204 °C |
0.0500 hour @Temperature 399 °F |
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Lord Adhesives Flocklok® 853A Flock Adhesive LORD Flocklok® 853A is a blocked, heat-curing, singlecoat adhesive used to adhere polyester or nylon flock fibers to a variety of elastomers including EPDM, NR, CR and SBR. Flocked substrates pro.. |
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Cure Time | 3.00 min @Temperature 204 °C |
0.0500 hour @Temperature 399 °F |
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Lord Adhesives Flocklok® 870 Flock Adhesive LORD Flocklok® 870 adhesive is a single-coat adhesive used to adhere polyester or nylon flock if beers to a variety of elastomers including EPDM, NR, CR and SBR. Flocked substrates provide good r.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials C2020322D6 Platinum Polymeric Ink C2020322D6 is a screen printable Platinum ink designed for printing working electrodes in electrochemical sensor applications. The paste can be used to detect H2O2, is suitable for developing biose.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials C2050712D58 Silver Ink for ITO Substrates This product is based on a unique curing process that results in the low temperature formation of a thermosetting polymer. Inks containing these polymers combine excellent chemical, environmental a.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials C2061027P13 High Brightness Phosphor Ink (Blue/Green) This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials C2061027P15 High Brightness Phosphor Ink (Blue) This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials C2070126P5 High Brightness Phosphor Ink (White) This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials C2080211P2 High Brightness Phosphor Ink (Blue/Green & Blue) This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials C2090819P2 Silver Ink This product is part of a range of Heat Curable Inks designed specifically for use in Photovoltaic panels. These products are based on a unique curing process that results in the low temperature fo.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials C2101125P4 High Brightness Phosphor Ink This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera.. |
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Cure Time | 3.00 - 4.02 min @Temperature 121 °C |
0.0500 - 0.0670 hour @Temperature 250 °F |
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Master Bond EP17HT-3 One component, snap-curing epoxy system Product Description: Master Bond Polymer System EP17HT-3 is a one part epoxy that fully cures in 2-3 minutes at 250-300°F. It is capable of service up to +400°F with excellent strength retention p.. |
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Cure Time | 3.00 min @Temperature 95.0 °C |
0.0500 hour @Temperature 203 °F |
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Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi.. |
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Cure Time | 3.00 min @Temperature 150 °C |
0.0500 hour @Temperature 302 °F |
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Tra-Con Tra-Bond 77-1S One Component SMD Adhesive TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 7.. |
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Cure Time | 3.00 min @Temperature 232 °C |
0.0500 hour @Temperature 450 °F |
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3M Scotchcast™ 5388 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 5388 is a one-part, blue pigmented, rapid heat curing powder resin, designed to provide a continuous, tough moisture and chemical resistant dielectric coating to a var.. |
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Cure Time | 3.00 min @Temperature 246 °C |
0.0500 hour @Temperature 475 °F |
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3M Scotchkote™ 206N Fusion Bonded Epoxy Coating (Fluid Bed Grade) 3M Scotchkote Fusion-Bonded Epoxy Coating 206N (Fluid Bed Grade) is a one-part, heat curable, thermosetting epoxy coating designed for corrosion protection of metal. The epoxy is applied to preheate.. |
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Cure Time | 3.00 min @Temperature 899 °C |
0.0500 hour @Temperature 1650 °F |
Step 3 |
Aremco Aremco-Seal™ 617 High Temperature Glass Coating Glass-filled adhesive/sealer for use with porous ceramics and refractories to 1500 ºF (816 ºC). |
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Cure Time | 3.00 - 4.98 min @Temperature 75.0 °C |
0.0500 - 0.0830 hour @Temperature 167 °F |
Recoat, at 50% humidity |
Blue River Coatings Acrylic 4000D Topcoat BLUE RIVER COATINGS ACRYLIC 4000 TOPCOAT is a hard, flexible, economical coating designed for multiple substrates. BLUE RIVER COATINGS ACRYLIC 4000 TOPCOAT offers good application properties, low fo.. |
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Cure Time | 3.00 min @Temperature 130 °C |
0.0500 hour @Temperature 266 °F |
belt dryer |
Gwent Electronic Materials D2090130P5 Pink Dielectric Ink This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera.. |
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Cure Time | 3.00 min @Temperature 155 °C |
0.0500 hour @Temperature 311 °F |
ts2 |
TSE Industries Millathane® 76 Millable Polyester Polyurethane Rubber, 3.0 PHR MBTS Millathane® 76 is a very suitable choice for use in products such as bushings, small copier rolls; automotive applications — bumpers, o-rings, hydraulic seals, belts, gaskets, solid tires — and m.. |