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Polymer Property : Cure Time = 20.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 20.0 min @Temperature 177 °C |
0.333 hour @Temperature 351 °F |
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| Resinlab® EP950NMF Gray Non-Metallic Filled Rubber Modified Epoxy Resinlab™ EP950NMF Gray is a non-metallic filled version of EP950G. It is a one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated tem.. |
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| Cure Time | 20.0 min @Temperature 125 °C |
0.333 hour @Temperature 257 °F |
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| Momentive Performance Materials LVG342 Low Volatile Silicone Adhesive, Mixed, White LVG342 low volatile silicone adhesive is a two component, thixotropic silicone adhesive that cures very quickly at elevated temperatures to a durable elastomer. LV342 was specifically developed for.. |
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| Cure Time | 20.0 min @Temperature 25.0 °C |
0.333 hour @Temperature 77.0 °F |
Tack-free, 50% R.H. |
| Momentive Performance Materials N-Sil® RTV123 Silicone Modified Alkoxy Adhesive Sealants, Black N-Sil® adhesive sealants are one-component, ready-to-use, and cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature.Key Performance Properties: Primer.. |
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| Cure Time | 20.0 min @Temperature 25.0 °C |
0.333 hour @Temperature 77.0 °F |
Tack-free, 50% R.H. |
| Momentive Performance Materials N-Sil® RTV128 Silicone Modified Alkoxy Adhesive Sealants, Translucent N-Sil® adhesive sealants are one-component, ready-to-use, and cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature.Key Performance Properties: Primer.. |
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| Cure Time | 20.0 min @Temperature 125 °C |
0.333 hour @Temperature 257 °F |
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| Momentive Performance Materials LVG342A Low Volatile Silicone Adhesive Component, White LVG342 low volatile silicone adhesive is a two component, thixotropic silicone adhesive that cures very quickly at elevated temperatures to a durable elastomer. LV342 was specifically developed for.. |
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| Cure Time | 20.0 min @Temperature 150 °C |
0.333 hour @Temperature 302 °F |
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| Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an.. |
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| Cure Time | 20.0 min @Temperature 90.0 °C |
0.333 hour @Temperature 194 °F |
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| Tra-Con Tra-Bond 723C01 One-Part Medical Grade Adhesive TRA-BOND 723C01 is a fast, heat curing, one component adhesive targeted at medical applications. The material complies with USP Class VI toxicity requirements and is resistant to gamma sterilization.. |
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| Cure Time | 20.0 min @Temperature 150 °C |
0.333 hour @Temperature 302 °F |
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| Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation.. |
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| Cure Time | 20.0 min @Temperature 120 °C |
0.333 hour @Temperature 248 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 3193-17 Lighting Epoxy Adhesive Emerson & Cuming 3193-17 Eccobond® Lighting Epoxy AdhesiveOne component, heat curing thixotropic epoxy adhesive. 100% solids and elastomer modified. Bonds well to ABS, polycarbonate and other heat .. |
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| Cure Time | 20.0 min @Temperature 120 °C |
0.333 hour @Temperature 248 °F |
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| Trelleborg Emerson & Cuming Eccobond® D 275 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming D 275 Eccobond® One-Component Fast Cure Epoxy AdhesiveSemi-rigid, high strength, fast curing, pourable, epoxy structural adhesive. Good peel strength (12 pli), Recommended for bond.. |
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| Cure Time | 20.0 min @Temperature 175 °C |
0.333 hour @Temperature 347 °F |
|
| Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic.. |
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| Cure Time | 20.0 min @Temperature 25.0 °C |
0.333 hour @Temperature 77.0 °F |
tack free |
| Cytec CC-1191 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 20.0 min @Temperature 25.0 °C |
0.333 hour @Temperature 77.0 °F |
tack free |
| Cytec CE-1171 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 20.0 - 30.0 min @Temperature 25.0 °C |
0.333 - 0.500 hour @Temperature 77.0 °F |
tack free |
| Cytec Conathane® CC-1194 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 20.0 - 30.0 min @Temperature 25.0 °C |
0.333 - 0.500 hour @Temperature 77.0 °F |
tack free |
| Cytec Conathane® CE-1164 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 20.0 min @Temperature 120 °C |
0.333 hour @Temperature 248 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Cure Time | 20.0 min @Temperature 120 °C |
0.333 hour @Temperature 248 °F |
|
| Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology |
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| Cure Time | 20.0 min @Temperature 120 °C |
0.333 hour @Temperature 248 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large di.. |
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| Cure Time | 20.0 min @Temperature 100 °C |
0.333 hour @Temperature 212 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
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| Cure Time | 20.0 min @Temperature 100 °C |
0.333 hour @Temperature 212 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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| Cure Time | 20.0 min @Temperature 100 °C |
0.333 hour @Temperature 212 °F |
minimum |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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| Cure Time | 20.0 min @Temperature 80.0 °C |
0.333 hour @Temperature 176 °F |
minimum |
| Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope.. |
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| Cure Time | 20.0 min @Temperature 177 °C |
0.333 hour @Temperature 351 °F |
|
| 3M Scotchcast™ 262 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 262 is a widely used, well-known general purpose epoxy powder resin. A one-part, red pigmented, rapid heat-curing product, it is designed to provide a continuous, toug.. |
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| Cure Time | 20.0 min @Temperature 180 °C |
0.333 hour @Temperature 356 °F |
|
| Abatron AboCast 8708-10 One-Component Structural/Dielectric Epoxy AboCast 8708-10 is a highly filled, class H (180°C) structural, castable adhesive compound for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Em.. |
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| Cure Time | 20.0 min @Temperature 177 °C |
0.333 hour @Temperature 351 °F |
|
| 3M Scotchcast™ 265 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 265 is a new solution to an old problem. Historically, manufactures of coils, stators and armatures have used liquid-based varnishes or resins to coat and impregnate t.. |
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| Cure Time | 20.0 min @Temperature 177 °C |
0.333 hour @Temperature 351 °F |
|
| 3M Scotchkote™ 412 Spray Grade Fusion Bonded Epoxy Coating 3M Scotchkote Spray Grade Fusion Bonded Epoxy Coating 413 is a one-part, heat curable, thermosetting epoxy coating designed for corrosion protection of reinforcing steel. The epoxy is applied to pre.. |
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| Cure Time | 20.0 min @Temperature 70.0 °C |
0.333 hour @Temperature 158 °F |
EN 2243-1 |
| Hexcel® Redux® 810 Two-Part Epoxy Paste Adhesive Redux® 810 is a multi-purpose, high shear and peel strength, two-part, toughened epoxy paste adhesive with corrosion-inhibiting properties.Features: Available in cartridges with a static mixer and .. |
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