Polymer Property : Cure Time = 1.00 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	<= 1.00 min	<= 0.0167 hour	With Primer (Fixture)
ND Industries NutGrade® 122 Removable Threadlocker A medium strength, oil tolerant threadlocker. Seals most types of nuts and bolts allowing disassembly using standard tools.Typical Usesstuds and bolts, threaded pipe fittings, and locking nuts or b..
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	handling time
Permabond TA436 Toughened Acrylic Adhesive PERMABOND TA436 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics and some thermoplastics. Permabond TA436 is a no-mix system which obtains handling strength..
Cure Time	<= 1.00 min	<= 0.0167 hour	Polycarbonate, fixture time, (low power 4mW lamp)
Permabond UV648 UV-curable Adhesive PERMABOND UV648 is a UV-curing adhesive developed for use on plastics. It has good adhesion to acrylic and contains a long-wavelength photo initiator to allow it to cure through UV-stabilized plasti..
Cure Time	1.00 - 30200 min	0.0167 - 504 hour	Average value: 3380 min Grade Count:18
Overview of materials for Epoxy, Cast, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr..
Cure Time	1.00 - 480 min @Temperature 71.1 - 204 °C	0.0167 - 8.00 hour @Temperature 160 - 400 °F	Average value: 71.3 min Grade Count:32
Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val..
Cure Time	1.00 - 3.00 min @Temperature 204 - 260 Â°C	0.0167 - 0.0500 hour @Temperature 399 - 500 Â°F
Lord Adhesives FlocklokÂ® 550P Flock Adhesive LORD FlocklokÂ® 550P adhesive is a single-coat adhesive used to adhere polyester or nylon flock fibers to a variety of uncured and semi-cured elastomers including EPDM, NR, CR and SBR. Flocked sub..
Cure Time	1.00 min	0.0167 hour	Fixture time
ITW Devcon One minuteâ„¢ Epoxy Gel, Amber Information provided by ITW Devcon
Cure Time	1.00 min	0.0167 hour	60 sec. @ 180ºC under 200 psi load
Loctite® 3440 1 component Gold/polymer filler Anisotropic Epoxy Adhesive Electrically Conductive Bonding and Encapsulants and UnderfillsLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a ..
Cure Time	1.00 min	0.0167 hour
Loctite® 392 Rapid Fixture Structural Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Cure Time	1.00 min	0.0167 hour	Dry Time
Loctite® 7113 Heptane Base Accelerator Surface PreparersLoctite offers a complete line of surface preparation products to ensure the maximum performance of Loctite® Adhesives and Sealants.Loctite® Accelerators are used to increase the ..
Cure Time	1.00 min	0.0167 hour
Loctite® SpeedBonder™ 326 Fast Fixture Acrylic Bonding Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-30 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-31 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-32 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-37 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-38 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 10.0 min	0.0167 - 0.167 hour
Abatron L060330-2 Flexible Polyurea Compound L060330-2 is used for castings, repairs, assemblies, coatings, and laminations that require fast hardening. It is also used for bonding most rigid materials such as metals, aluminum, copper, china, ..
Cure Time	1.00 - 1.17 min	0.0167 - 0.0194 hour	per mm
Amity Thermosets ATS 134 Phenolic Molding Inorganic, graphite Filler, Compression Molded Characteristics: Low coefficient of frictionSelf lubricating ( graphite modified )Good thermal conductivityGood glide propertiesNot suitable for electrical applicationColor- black gray Soft/medium f..
Cure Time	1.00 - 2.00 min	0.0167 - 0.0333 hour
3M Scotch-Weld™ CA50 Gel Instant Adhesive 3M™ Scotch-Weld™ Instant Adhesives are single component, high strength cyanoacrylate adhesives. High-viscosity, non-sag gel and less sensitive to acidic surfaces.Information provided by 3M
Cure Time	1.00 min	0.0167 hour	Set Time
3M Scotch-Weld™ EZ250060 Polyurethane Reactive (PUR) Easy 250 Wood Adhesive 3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Wood Adhesive is 100% solid, warm temperature applied, moisture curing urethanes. This product bonds well to wood and wood bases surfaces as w..
Cure Time	1.00 min	0.0167 hour	Set Time
3M Scotch-Weld™ TE100 Polyurethane Reactive Adhesive 3M™ Scotch-Weld™ Polyurethane Reactive Adhesives are a family of one-component, moisture curing, urethane adhesives. These adhesives are applied warm and bond a wide variety of substrates such as ..
Cure Time	1.00 min	0.0167 hour	Tack-free
3M FIP 1-Step Fire Barrier Rated Foam 3M Fire Barrier Rated Foam (FIP 1-Step), is a smoke, sound, and firestopping foam for wall and floor penetrations. Premium two-part, easy-to-handle formulations. Expands up to five times during inst..
Cure Time	1.00 min	0.0167 hour	Set Time
3M Scotch-Weld™ TS115 HGS Polyurethane Reactive Adhesive 3M™ Scotch-Weld™ Polyurethane Reactive Adhesives are a family of one-component, moisture curing, urethane adhesives. These adhesives are applied warm and bond a wide variety of substrates such as ..
Cure Time	1.00 - 1.50 min @Temperature 150 °C	0.0167 - 0.0250 hour @Temperature 302 °F
Loctite® CHIPBONDER® 3615 High Adhesion, Syringe Dispense Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te..
Cure Time	1.00 - 1.50 min @Temperature 150 °C	0.0167 - 0.0250 hour @Temperature 302 °F
Loctite® CHIPBONDER® 3618 High Speed, Syringe Dispense Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te..
Cure Time	1.00 min	0.0167 hour	at 40 mW/cm^2
Loctite® Nuva-Sil® 5088 Potting Compound Potters and Silicon Light Cure AdhesivesLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and sho..
Cure Time	1.00 min	0.0167 hour	at 40 mW/cm^2
Loctite® Nuva-Sil® 5091 High Adhesion Potting Potters and Silicon Light Cure AdhesivesLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and sho..
Cure Time	1.00 min	0.0167 hour	at 70 mW/cm^2
Loctite® Nuva-Sil® 5092 Non-corrosive Potting Silicon Light Cure Adhesives and PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and sho..
Cure Time	1.00 - 2.67 min	0.0167 - 0.0444 hour	Gelation time
Mitsui MILEX™ RX-2325C Low Silicone Rubber Modified Phenolic Resin (discontinued **) The MILEX™ Family of products is widely featured in brake systems of automobiles made by the top automakers through Mitsui Chemicals' affiliation with leading brake manufacturers. The phenolic ..