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Hexcel® HexPly® 954-3 Curing Cyanate Resin

Category Polymer , Thermoset , Epoxy
Manufacturer Hexcel
Trade Name HexPly®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® HexPly® 954-3 Curing Cyanate Resin.pdf
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Material Notes:
HexPly® 954-3 is a 350°F (177°C) curing cyanate resin with excellent resistance to moisture absorption, outgassing and microcracking. HexPly® 954-3 is formulated for autoclave or press molding using a standard cure of two hours at 350°F (177°C). Glass transition temperature can be maximized by post curing at 450°F (232°C). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C2.Typical applications for HexPly® 954-3 include primary and secondary space structures and other applications where dimensional stability is critical.Information provided by HexCel
Physical Properties Metric English Comments
Density 1.19 g/cc
0.0430 lb/in³
Water Absorption 0.70 %
0.70 %
50% GH/EQ
Moisture Absorption at Equilibrium 0.18 %
0.18 %
55% RH/EQ
Outgassing - Total Mass Loss 0.20 %
0.20 %
954-3; ASTM E595
1.0 %
1.0 %
ASTM LIMITS; ASTM E595
Collected Volatile Condensable Material 0.010 %
0.010 %
954-3; ASTM E595
0.10 %
0.10 %
ASTM LIMITS; ASTM E595
Mechanical Properties Metric English Comments
Tensile Strength, Yield 57.0 MPa

@Temperature 23.0 °C
8270 psi

@Temperature 73.4 °F
Elongation at Break 2.4 %
2.4 %
Tensile Modulus 2.80 GPa

@Temperature 23.0 °C
406 ksi

@Temperature 73.4 °F
Flexural Yield Strength 77.0 MPa

@Temperature 163 °C
11200 psi

@Temperature 325 °F
Wet (7 day immersion at 71°C)
87.0 MPa

@Temperature 163 °C
12600 psi

@Temperature 325 °F
119 MPa

@Temperature 23.0 °C
17300 psi

@Temperature 73.4 °F
Flexural Modulus 2.10 GPa

@Temperature 163 °C
305 ksi

@Temperature 325 °F
Wet (7 day immersion at 71°C)
2.30 GPa

@Temperature 163 °C
334 ksi

@Temperature 325 °F
3.00 GPa

@Temperature 23.0 °C
435 ksi

@Temperature 73.4 °F
Thermal Properties Metric English Comments
CTE, linear 55.1 µm/m-°C
30.6 µin/in-°F
Glass Transition Temp, Tg 206 °C
403 °F
No post cure
258 °C
496 °F
With post cure
Electrical Properties Metric English Comments
Dielectric Constant 2.73

@Frequency 1.00e+10 Hz,
Temperature 23.0 °C
2.73

@Frequency 1.00e+10 Hz,
Temperature 73.4 °F
Unconditioned; ASTM D2520
2.73

@Frequency 1.00e+10 Hz,
Temperature 163 °C
2.73

@Frequency 1.00e+10 Hz,
Temperature 325 °F
Unconditioned; ASTM D2520
2.85

@Frequency 1.00e+10 Hz,
Temperature 23.0 °C
2.85

@Frequency 1.00e+10 Hz,
Temperature 73.4 °F
Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520
2.85

@Frequency 1.00e+10 Hz,
Temperature 163 °C
2.85

@Frequency 1.00e+10 Hz,
Temperature 325 °F
Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520
Dielectric Loss Index 0.0060

@Frequency 1.00e+10 Hz,
Temperature 23.0 °C
0.0060

@Frequency 1.00e+10 Hz,
Temperature 73.4 °F
Unconditioned; ASTM D2520
0.0080

@Frequency 1.00e+10 Hz,
Temperature 163 °C
0.0080

@Frequency 1.00e+10 Hz,
Temperature 325 °F
Unconditioned; ASTM D2520
0.010

@Frequency 1.00e+10 Hz,
Temperature 23.0 °C
0.010

@Frequency 1.00e+10 Hz,
Temperature 73.4 °F
Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520
0.020

@Frequency 1.00e+10 Hz,
Temperature 163 °C
0.020

@Frequency 1.00e+10 Hz,
Temperature 325 °F
Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520
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