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Resin Technology Group KONA 871 Low Cost Epoxy Resin

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resin Technology Group
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resin Technology Group KONA 871 Low Cost Epoxy Resin.pdf
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Material Notes:
Mix ratio 100 to 25 by weight.Kona 871 is a low cost epoxy resin system developed for production casting, potting, encapsulating and coating applications where easy handling, good flowability and low thermal coefficient of expansion over a wide temperature is required. Kona 871 with its good exotherm, pot life and pouring characteristics is especially suited for large mass castings as well as for other industrial and electronic large pour applications. It develops excellent adhesion to rigid plastics, laminates, ceramics and metals, has a low coefficient of thermal expansion, and can be readily machined with ordinary shop tools. The fully cured system is a good electrical insulator and is compatible with electrical components, has good resistance to water, weather, gases and vapors and to many commercial organic and inorganic compounds including mild acids and alkalis, many corrosive salts, jet fuels and petroleum products and lubricants.Applications: Kona 871 is a versatile epoxy casting system, which may be cured with a room temperature or elevated temperature-curing agent. Select the catalyst that best suits your requirements.Information provided by Resin Technology Group.
Physical Properties Metric English Comments
Specific Gravity 1.55 g/cc
1.55 g/cc
Viscosity 15000 cP

@Temperature 25.0 °C
15000 cP

@Temperature 77.0 °F
Mixed
Mechanical Properties Metric English Comments
Hardness, Shore D 84
84
Compressive Strength >= 96.5 MPa
>= 14000 psi
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 120 °C
248 °F
Electrical Properties Metric English Comments
Dielectric Strength >= 15.7 kV/mm
>= 400 kV/in
Dissipation Factor 0.020

@Frequency 1e+6 Hz
0.020

@Frequency 1e+6 Hz
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
720 - 1080 min

@Temperature 25.0 °C
12.0 - 18.0 hour

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Black
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