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Parker Chomerics CHO-BOND 589-29 Conductive Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 589-29 Conductive Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Low cost, highly conductive adhesive system which combines the strong adhesion characteristics of an epoxy with the superior conductivity of silver. CHO-BOND 589-29 adhesive meets the most exacting electrical requirements without the high temperatures, fluxes and expensive preparatory techniques usually required for conventional solder systems.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	2.20 - 2.80 g/cc	2.20 - 2.80 g/cc
Solids Content	100 %	100 %
Thickness	254 microns	10.0 mil	Recommended

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 4.48 MPa	>= 650 psi
	9.66 MPa @Temperature 116 °C, Time 900 sec	1400 psi @Temperature 240 °F, Time 0.250 hour	Lap

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.050 ohm-cm	0.050 ohm-cm	R.T. cure
	<= 0.0020 ohm-cm @Temperature 116 °C, Time 900 sec	<= 0.0020 ohm-cm @Temperature 240 °F, Time 0.250 hour	DC

Processing Properties	Metric	English
Cure Time	15.0 min @Temperature 116 °C	0.250 hour @Temperature 241 °F
	1440 min @Temperature 24.0 °C	24.0 hour @Temperature 75.2 °F
Shelf Life	9.00 Month	9.00 Month

Descriptive Properties	Value	Comments
Binder	Epoxy
Color	Silver
Consistency	Thin Paste
Coverage	156.1 cm²/g
Filler	AG
Mix Ratio	7 to 100
Work Life	0.5 hr

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