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Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant
| Category | Polymer , Thermoset , Epoxy , Filled/Reinforced Thermoset |
| Manufacturer | Tra-Con, Inc. |
| Trade Name | Tra-Bond |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical protection. TRA-BOND 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured systems. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests.Information provided by Tra-Con Inc.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 2.10 g/cc | 2.10 g/cc | Cured |
| Water Absorption | 0.11 % | 0.11 % | |
| Viscosity | 360500 cP @Temperature 25.0 °C |
360500 cP @Temperature 77.0 °F |
After mixing |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 92 | 92 | |
| Adhesive Bond Strength | 17.2 MPa | 2500 psi | Lap shear, alum to alum, 2 hrs @ 150°C |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | Below Tg |
| 100 µm/m-°C | 55.6 µin/in-°F | Above Tg | |
| Thermal Conductivity | 1.00 W/m-K @Temperature 121 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 250 °F |
|
| Maximum Service Temperature, Air | 150 °C | 302 °F | |
| Minimum Service Temperature, Air | -60.0 °C | -76.0 °F | |
| Glass Transition Temp, Tg | 124 °C | 255 °F | Ultimate Tg |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+16 ohm-cm @Temperature 100 °C |
1.00e+16 ohm-cm @Temperature 212 °F |
|
| Dielectric Constant | 6.1 | 6.1 | |
| Dielectric Strength | 39.4 kV/mm | 1000 kV/in | |
| Dissipation Factor | 0.0070 | 0.0070 |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 55 ppm | 55 ppm | |
| Ionic Impurities - Cl (Chloride) | 300 ppm | 300 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| 120 min @Temperature 125 °C |
2.00 hour @Temperature 257 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Black | |
| Water Extract Conductivity umhos/cm | 290 | |
| Weight Loss % | 0.67 | At 300°C |
| Working Life, months | 2 | At 25°C |
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