Atom Adhesives AA-BOND 2153 Epoxy Adhesive

AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.Appearance: Dark GreyCure Type: Heat cure or Room TemperatureBenefits:StrongDurableHigh impact bonds at room temperature Mix Ratio by weight: 100:7/Resin:Hardener Typical Application: Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boardsInformation provided by Atom Adhesives