Songhan Plastic Technology Co.,Ltd.

Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: Shiny silver appearance after cure is cosmetically desired in the LED industry.One component chemistry provides ease of use and long pot life.Low viscosity and high thixotropy ideal for high speed dotting and stamping processes.High strength after MSL 1 moisture test.Moderate Tg provides a robust and strong chemistry for small sized LEDs < 13 mil x 13 milSuggested Applications:Semiconductor: die attach onto lead-framesElectronics:Electrically conductive adhesive (“ECA”)for PCB and level 3&4 connections to SMDs, discrete components and connectors.Automotive proven ECA and COB die-attach epoxy.Optics: LED die attach, ECA for LED and fiber optic industryInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.74 g/cc
2.74 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 2500 - 3300 cP

@Temperature 23.0 °C
2500 - 3300 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 85
Tensile Modulus 4.67 GPa
677 ksi
Shear Strength >= 23.4 MPa
>= 3400 psi
Thermal Properties Metric English Comments
CTE, linear 28.0 µm/m-°C
15.6 µin/in-°F
Below Tg
117 µm/m-°C
65.0 µin/in-°F
Above Tg
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
300 °C
572 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
-55.0 °C
-67.0 °F
Glass Transition Temp, Tg >= 65.0 °C
>= 149 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 380 °C
716 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00090 ohm-cm
<= 0.00090 ohm-cm
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 160 °C
0.500 hour

@Temperature 320 °F
Minimum Bond Line
Pot Life 40320 min
40320 min
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Silver
Consistency Smooth thixotropic paste
Number of Components Single
Thixotropic Index 5.5
Weight Loss 0.22%
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