Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide

Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging. Advantages & Application Notes: It is a lower viscosity version of EPO-TEK® P1011 for improved die-stamping or pin transfer process methodsSuggested applications in hybrid micro-electronics:Resisting ceramic or metal SMD lid sealing processes >300°C.Die attaching quartz crystal oscillators to the Au post of TO-cans or Au/ pads on ceramic PCBs.Down-hole petrochemical circuitsAtomic clocks, microwave or millimeter wave circuitsDie-attaching LED and EEPROM chips inside alpha numeric displays, resisting glass lid-sealing processes >300°C.A two-step cure is suggested for optimal adhesive properties.Available in alternative viscositiesInformation Provided by Epoxy Technology