Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage (dis

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound , Filled/Reinforced Thermoset
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage (dis.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL listed molding compound 1.5 mm/HB (BK).Application areas: Electrotechnical parts, thermally, chemically, and mechanically stressed parts, e.g. terminal boards, bobbins, car electronics, reflectors, spark plug connectors.Information provided by Bak AGBak AG became a part of Hexion in 2005.

Physical Properties	Metric	English	Comments
Density	1.85 g/cc	0.0668 lb/in³	ISO 1183
Apparent Bulk Density	0.800 g/cc	0.0289 lb/in³	ISO 60
Linear Mold Shrinkage, Flow	0.0025 cm/cm	0.0025 in/in	Injection molding; ISO 2577

Mechanical Properties	Metric	English	Comments
Ball Indentation Hardness	350 MPa	50800 psi	H 961/30; ISO 2039/P1
Tensile Strength at Break	70.0 MPa	10200 psi	5 mm/min; ISO 527 - 1/2
Tensile Modulus	14.0 GPa	2030 ksi	1 mm/min; ISO 527 - 1/2
Flexural Strength	120 MPa	17400 psi	2 mm/min; ISO 178
Flexural Modulus	14.5 GPa	2100 ksi	ISO 178
Compressive Strength	150 MPa	21800 psi	Test specimen flat tested; ISO 604
Charpy Impact Unnotched	0.800 J/cm² @Temperature 23.0 °C	3.81 ft-lb/in² @Temperature 73.4 °F	ISO 179-1/2 eU
Charpy Impact, Notched	0.220 J/cm² @Temperature 23.0 °C	1.05 ft-lb/in² @Temperature 73.4 °F	ISO 179-1/2 eA

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	170 °C	338 °F	<20000 hours; IEC 60216-P1
	210 °C	410 °F	< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
UL RTI, Electrical	130 °C @Thickness 1.50 mm	266 °F @Thickness 0.0591 in	BK
UL RTI, Mechanical with Impact	130 °C @Thickness 1.50 mm	266 °F @Thickness 0.0591 in	BK
UL RTI, Mechanical without Impact	130 °C @Thickness 1.50 mm	266 °F @Thickness 0.0591 in	BK
Flammability, UL94	HB @Thickness 1.50 mm	HB @Thickness 0.0591 in	BK
Shrinkage	0.000 % @Temperature 110 °C, Time 605000 sec	0.000 % @Temperature 230 °F, Time 168 hour	Injection molding; ISO 2577

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+13 ohm-cm	1.00e+13 ohm-cm	IEC 60093
Surface Resistance	1.00e+12 ohm	1.00e+12 ohm	IEC 60093
Dielectric Constant	6.0 @Frequency 100 Hz	6.0 @Frequency 100 Hz	IEC 60250
Dielectric Strength	25.0 kV/mm @Thickness 1.00 mm	635 kV/in @Thickness 0.0394 in	IEC 60243-P1
Dissipation Factor	0.020 @Frequency 100 Hz	0.020 @Frequency 100 Hz	IEC 60250
Arc Resistance	190 - 195 sec	190 - 195 sec	ASTM D495
Hot Wire Ignition, HWI	>= 120 sec @Thickness 1.50 mm	>= 120 sec @Thickness 0.0591 in	BK
High Amp Arc Ignition, HAI	>= 120 arcs @Thickness 1.50 mm	>= 120 arcs @Thickness 0.0591 in	BK
High Voltage Arc-Tracking Rate, HVTR	0.000 - 10.0 mm/min @Thickness 3.00 mm	0.000 - 0.394 in/min @Thickness 0.118 in	BK

Processing Properties	Metric	English	Comments
Feed Temperature	60.0 - 75.0 °C	140 - 167 °F	Injection molding
Nozzle Temperature	70.0 - 100 °C	158 - 212 °F	Injection molding
Melt Temperature	90.0 - 100 °C	194 - 212 °F	Injection molding
Mold Temperature	160 - 190 °C	320 - 374 °F	Compression molding
	170 - 190 °C	338 - 374 °F	Injection molding
Injection Pressure	>= 10.0 MPa	>= 1450 psi	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Cure Time	0.250 - 0.417 min	0.00417 - 0.00694 hour	Per 1 mm of wall thickness, injection molding
	0.500 - 1.00 min	0.00833 - 0.0167 hour	Per 1 mm of wall thickness, compression molding

Descriptive Properties	Value	Comments
Chromatic Spectrum	Subdued Colors
Creep Rupture Strength	Very Good
Holding Pressure	Approximately 40-60% of injection pressure
Media Resistance	Very Good
Moisture Absorption	10 mg	ISO 62, 24 hours at 23°C
Reserves by Peak Temperature	Very High
Thermal Expansion	Very Slight

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