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Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength

Category Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength.pdf
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Material Notes:
Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, high mechanical strength.Application areas: Cooling pumps, solenoid switch covers, magnetic switches, mechanically and thermally highly stressed parts in automotive construction, electrical motor end shields, housing parts, pulleys, tension return pulleys, cog wheels, impellers, bearing parts.Information provided by Bakelite AGBakelite AG became a part of Hexion in 2005.
Physical Properties Metric English Comments
Density 1.58 g/cc
0.0571 lb/in³
ISO 1183
Apparent Bulk Density 0.710 g/cc
0.0257 lb/in³
ISO 60
Linear Mold Shrinkage, Flow 0.0015 cm/cm
0.0015 in/in
Injection molding; ISO 2577
Mechanical Properties Metric English Comments
Ball Indentation Hardness 250 MPa
36300 psi
H 961/30; ISO 2039/P1
Tensile Strength at Break 85.0 MPa
12300 psi
5 mm/min; ISO 527 - 1/2
Tensile Modulus 10.5 GPa
1520 ksi
1 mm/min; ISO 527 - 1/2
Flexural Strength 140 MPa
20300 psi
2 mm/min; ISO 178
Flexural Modulus 10.5 GPa
1520 ksi
ISO 178
Compressive Strength 180 MPa
26100 psi
Test specimen flat tested; ISO 604
Charpy Impact Unnotched 1.50 J/cm²

@Temperature 23.0 °C
7.14 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.350 J/cm²

@Temperature 23.0 °C
1.67 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eA
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 165 °C
329 °F
<20000 hours; IEC 60216-P1
220 °C
428 °F
< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 170 °C
338 °F
ISO 75-2
Shrinkage 0.150 %

@Temperature 110 °C,
Time 605000 sec
0.150 %

@Temperature 230 °F,
Time 168 hour
Injection molding; ISO 2577
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+12 ohm-cm
1.00e+12 ohm-cm
IEC 60093
Surface Resistance 1.00e+11 ohm
1.00e+11 ohm
IEC 60093
Dielectric Constant 7.0

@Frequency 100 Hz
7.0

@Frequency 100 Hz
IEC 60250
Dielectric Strength 25.0 kV/mm

@Thickness 1.00 mm
635 kV/in

@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.11

@Frequency 100 Hz
0.11

@Frequency 100 Hz
IEC 60250
Comparative Tracking Index 150 V
150 V
Test liquid A; IEC 60112
Processing Properties Metric English Comments
Feed Temperature 60.0 - 75.0 °C
140 - 167 °F
Injection molding
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Melt Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Mold Temperature 160 - 190 °C
320 - 374 °F
Injection molding
160 - 190 °C
320 - 374 °F
Compression molding
Injection Pressure >= 15.0 MPa
>= 2180 psi
Compression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa
72.5 - 290 psi
Injection molding
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Descriptive Properties Value Comments
Chromatic Spectrum All Colors
Creep Rupture Strength Very Good
Holding Pressure Approximately 40-60% of injection pressure
Media Resistance Very Good
Moisture Absorption 13 mg
ISO 62, 24 hours at 23°C
Reserves by Peak Temperature Very High
Thermal Expansion Very Slight
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