Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPOTEK® H20E.Advantages & Application Notes: Processing info - it can be applied by many dispensing, stamping and screen printing techniques.Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a singlecomponent fashion.Screen Printing: best using >200 metal mesh with polymer squeegee blade with 80D hardness.Stamping: small dots 6 mil in diameter can be realized.Misc /Other notes:Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil.Suggested applications:LED – HB LED industry; light engines for HD-TV; LCD color projection.Solar, die-attach epoxy for CPV chips onto ceramic carriers; thermal epoxy for ceramic to aL finned heat sink.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	3.44 g/cc	3.44 g/cc	Part A
	4.39 g/cc	4.39 g/cc	Part B
Particle Size	<= 45 µm	<= 45 µm
Viscosity	3500 - 6000 cP @Temperature 23.0 °C	3500 - 6000 cP @Temperature 73.4 °F	50 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	93	93
Tensile Modulus	3.9490 GPa	572.75 ksi	Storage
Shear Strength	11.7 MPa	1700 psi	Lap

Thermal Properties	Metric	English	Comments
CTE, linear	53.0 µm/m-°C	29.4 µin/in-°F	Below Tg
	80.0 µm/m-°C	44.4 µin/in-°F	Above Tg
Thermal Conductivity	10.9 W/m-K @Temperature 150 °C, Time 3600 sec	75.6 BTU-in/hr-ft²-°F @Temperature 302 °F, Time 1.00 hour
	23.0 W/m-K @Temperature 150 °C, Time 3600 sec	160 BTU-in/hr-ft²-°F @Temperature 302 °F, Time 1.00 hour	+ 200°C/1Hr
Maximum Service Temperature, Air	175 °C	347 °F	Continuous
	275 °C	527 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Decomposition Temperature	372 °C	702 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.000080 ohm-cm	<= 0.000080 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	24 ppm	24 ppm
Ionic Impurities - K (Potassium)	>= 17 ppm	>= 17 ppm
Ionic Impurities - Cl (Chloride)	34 ppm	34 ppm

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 175 °C	0.500 hour @Temperature 347 °F	Minimum Bond Line
Pot Life	3600 min	3600 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Silver	Part A
	Silver	Part B
Consistency	Smooth thixotropic paste
Ionic Impurities NH4	45 ppm
Mix Ratio By Weight	1:1
Number of Components	Two
Thixotropic Index	3.48
Weight Loss	0.14%	200°C
	0.42%	250°C
	1.05%	300°C

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