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Epoxyset Epoxibond EB-115 Unfilled Epoxy Adhesive

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Epoxyset
Trade Name	Epoxibond
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxyset Epoxibond EB-115 Unfilled Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.

Physical Properties	Metric	English	Comments
Density	1.16 g/cc	0.0419 lb/in³
Viscosity	6000 - 7000 cP	6000 - 7000 cP

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	89	89	ASTM D2240
Adhesive Bond Strength	>= 13.8 MPa	>= 2000 psi	Lap Shear Strength

Thermal Properties	Metric	English
CTE, linear	>= 50.0 µm/m-°C	>= 27.8 µin/in-°F
Maximum Service Temperature, Air	230 °C	446 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Glass Transition Temp, Tg	>= 130 °C	>= 266 °F

Optical Properties	Metric	English	Comments
Refractive Index	1.54	1.54

Processing Properties	Metric	English
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
	120 min @Temperature 125 °C	2.00 hour @Temperature 257 °F
Pot Life	120 min	120 min

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