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- Parker Chomerics CHO-BOND 592 Conductive Epoxy
Parker Chomerics CHO-BOND 592 Conductive Epoxy
| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND 592 Conductive Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical conductivity, excellent adhesion, low temperature cure, easy mix ratio, low viscosity, low coefficient of thermal expansion, very low thermal impedance, and good thermal shock resistance.Typical Applications: Connects dissimilar materials electrically and thermally; Excels as a sealant for microwave modules and components; Ideal for circuit board repair and grounding applications and Useful for EMI shieldingInformation provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 2.35 - 2.85 g/cc | 2.35 - 2.85 g/cc | |
| Thickness | 25.4 microns | 1.00 mil | Recommended |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Shear Strength | >= 10.3 MPa | >= 1500 psi | Lap |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 99.0 °C | 210 °F | |
| Minimum Service Temperature, Air | -62.0 °C | -79.6 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.050 ohm-cm | <= 0.050 ohm-cm | DC |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 5.00 min @Temperature 302 °C |
0.0833 hour @Temperature 576 °F |
|
| 15.0 min @Temperature 125 °C |
0.250 hour @Temperature 257 °F |
||
| 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
||
| 60.0 min @Temperature 80.0 °C |
1.00 hour @Temperature 176 °F |
||
| 10100 min @Temperature 24.0 °C |
168 hour @Temperature 75.2 °F |
produces lower electrical conductivity | |
| Pot Life | 240 - 360 min @Temperature 25.0 °C |
240 - 360 min @Temperature 77.0 °F |
|
| 2880 min @Temperature 5.00 °C |
2880 min @Temperature 41.0 °F |
||
| Shelf Life | 9.00 Month | 9.00 Month |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Binder | Epoxy | |
| Color | Silver | |
| Consistency | Nearly Liquid | |
| Coverage | 170.3 cm2/g | |
| Filler | Ag | |
| Mix Ratio | 100 to 50 | A:B |
| Working Life | 4 hrs |
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