Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & Application Notes: Low density silver-filled epoxy is ideal for ultrasound and acoustical applications of electronics.Extended pot-life allows for mass production and low waste.Suggested Applications:Hybrid Micro-electronics: SMD and die attach on Au pads and ceramic substrates. Single step curing method of die and SMDs.Electronics: compatible with piezo technologies for ultrasound circuits found in medical, industrial, and petrochemical industries.Scientific / Life Sciences: geo-thermal, geo-seismic, infra-sound, as well as acoustical-optical circuits for interferometers and lasers.Optical: bright and shiny silver flake is advantageous for LED die-attach.A smooth and creamy paste allows for automated or hand dispensing, pin transfer, or screen printing application methods of manufacture.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.05 g/cc	1.05 g/cc	Part B
	2.10 g/cc	2.10 g/cc	Part A
Particle Size	<= 45 µm	<= 45 µm
Viscosity	15000 - 23000 cP @Temperature 23.0 °C	15000 - 23000 cP @Temperature 73.4 °F	10 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	76	76
Tensile Modulus	3.34 GPa	485 ksi	Storage
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
	>= 13.8 MPa	>= 2000 psi	Lap

Thermal Properties	Metric	English	Comments
CTE, linear	28.0 µm/m-°C	15.6 µin/in-°F	Below Tg
	104 µm/m-°C	57.8 µin/in-°F	Above Tg
Thermal Conductivity	0.670 W/m-K	4.65 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 100 °C	>= 212 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	470 °C	878 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.020 ohm-cm	<= 0.020 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	88 ppm	88 ppm
Ionic Impurities - K (Potassium)	8.0 ppm	8.0 ppm
Ionic Impurities - Cl (Chloride)	60 ppm	60 ppm

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
	10.0 min @Temperature 120 °C	0.167 hour @Temperature 248 °F	Minimum Bond Line
	20.0 min @Temperature 100 °C	0.333 hour @Temperature 212 °F	Minimum Bond Line
	45.0 min @Temperature 80.0 °C	0.750 hour @Temperature 176 °F	Minimum Bond Line
Pot Life	1080 min	1080 min
Shelf Life	6.00 Month @Temperature 25.0 °C	6.00 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Silver	Part A
Consistency	Smooth paste
Ionic Impurities NH4	21 ppm
Mix Ratio By Weight	100:5
Number of Components	Two
Thixotropic Index	1.86
Weight Loss	0.04%	200°C
	0.04%	250°C
	0.1%	300°C

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