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Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resinlab®
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive.pdf
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Material Notes:
Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals and circuit board materials. These products give very good environmental protection and dielectric properties over a wide temperature range. The primary difference between the two versions is the LV version has a lower high shear viscosity (higher press flow rate) to provide easier dispensing. The amount of sag upon curing is the same.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 1.30 g/cc
1.30 g/cc
TM R050-16
Water Absorption 0.17 %

@Time 86400 sec
0.17 %

@Time 24.0 hour
TM R050-35
Viscosity 500000 cP
500000 cP
RVT, #7, 2.5 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
TM R050-17
Tensile Strength at Break 33.1 MPa
4800 psi
TM R050-36
Tensile Strength, Ultimate 33.1 MPa
4800 psi
TM R050-36
Tensile Strength, Yield 17.2 MPa
2500 psi
TM R050-36
Elongation at Break 0.00 - 1.0 %
0.00 - 1.0 %
TM R050-36
Tensile Modulus 4.83 GPa
700 ksi
TM R050-36
Compressive Yield Strength 86.2 MPa
12500 psi
TM R050-38
Compressive Strength 82.7 MPa
12000 psi
Break; TM R050-38
103 MPa
15000 psi
Ultimate; TM R050-38
Compressive Modulus 4.14 GPa
600 ksi
TM R050-38
Adhesive Bond Strength 10.3 MPa
1500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 48.0 µm/m-°C
26.7 µin/in-°F
Thermal Conductivity 0.360 W/m-K
2.50 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 115 °C
239 °F
TM R050-25
Electrical Properties Metric English Comments
Volume Resistivity 8.00e+14 ohm-cm
8.00e+14 ohm-cm
Dielectric Constant 3.5

@Frequency 100 Hz,
Temperature 25.0 °C
3.5

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 17.3 kV/mm
440 kV/in
Processing Properties Metric English Comments
Cure Time 5.00 - 10.0 min

@Temperature 150 °C
0.0833 - 0.167 hour

@Temperature 302 °F
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
30.0 min

@Temperature 110 °C
0.500 hour

@Temperature 230 °F
Descriptive Properties Value Comments
Color Black
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