Epoxy Technology EPO-TEK® 375 High Temperature Epoxy

Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen syringe.Advantages & Application Notes: Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices and resisting high temperature packaging.Down-hole petrochemical fiber optic sensors resisting >200°C field conditions.Fiber optic adhesive suggested applications:Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range.Fiber component packaging, adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.Medical suggested applications:Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including stainless steel, diamond, titanium, brass, ceramics, glass and most plastics.Certified to USP Class VI Biocompatibility Standards for medical implants; adhesive for catheter devices including stents and guide wires.Electronics Assembly suggested applications:Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.Structural grade epoxy found in hard-disk drive devices; bonding of stainless steel metals, kapton, and magnets.Information Provided by Epoxy Technology